Edge Grinding Machinery

We are offering here the Edge Grinding Machinery that is used in a process that is common to the manufacture of nearly all semiconductor related wafers and wafers that are used in the manufacture of many other electronic, solar, and nanotechnology devices. Edges are typically the least desirable aspects of floor preparation, however, we can't avoid them. The grinding equipment can be used to round edges of wafers after ingot slicing. Small wafer diameter changes (i.e. from 101.6mm to 100.0mm) can be accomplished. The Edge Grinding Machinery is made available by us in various types as per the need.